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US Patent Issued to BULL on Nov. 3 for "Electronic board equipped with a heat dissipation device and apparatus comprising such an electronic board" (French Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,150, issued on Nov. 3, was assigned to BULL SAS (Les Clayes-sous-Bois, France). "Electronic board equipped with a heat dissipation device an... Read More


US Patent Issued to Telefonaktiebolaget LM Ericsson on Nov. 3 for "Method of producing a PCB, as well as a PCB, and a circuit board" (Swedish Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,152, issued on Nov. 3, was assigned to Telefonaktiebolaget LM Ericsson (publ) (Stockholm). "Method of producing a PCB, as well as a PCB, and... Read More


US Patent Issued to Dell Products on Nov. 3 for "Conductive leak barriers to protect sensitive circuitry" (Texas Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,154, issued on Nov. 3, was assigned to Dell Products LP (Round Rock, Texas). "Conductive leak barriers to protect sensitive circuitry" was i... Read More


US Patent Issued to Murata Manufacturing on Nov. 3 for "Circuit module" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,156, issued on Nov. 3, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Circuit module" was invented by Tsuyoshi Takakura (Kyo... Read More


US Patent Issued to Samsung Electro-Mechanics on Nov. 3 for "Circuit board" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,157, issued on Nov. 3, was assigned to Samsung Electro-Mechanics Co. Ltd. (Suwon-si, South Korea). "Circuit board" was invented by Ho-Jae Le... Read More


US Patent Issued to MEC ADDHEAT (KAIPING) on Nov. 3 for "Anti-break structure for setting buffer sheets at circuit board edges" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,158, issued on Nov. 3, was assigned to MEC ADDHEAT (KAIPING) Co. LTD. (Kaiping City, China). "Anti-break structure for setting buffer sheets... Read More


US Patent Issued to NGK ELECTRONICS DEVICES, NGK INSULATORS on Nov. 3 for "Ceramic wiring member" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,159, issued on Nov. 3, was assigned to NGK ELECTRONICS DEVICES INC. (Mine, Japan) and NGK INSULATORS Ltd. (Nagoya, Japan). "Ceramic wiring m... Read More


US Patent Issued to JOHNAN on Nov. 3 for "Circuit board" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,160, issued on Nov. 3, was assigned to JOHNAN Corp. (Uji, Japan). "Circuit board" was invented by Yoshinari Matsuda (Uji, Japan), Kazuhiro K... Read More


US Patent Issued to CelLink on Nov. 3 for "Flexible interconnect circuits and methods of fabrication thereof" (Michigan, California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,161, issued on Nov. 3, was assigned to CelLink Corp. (San Carlos, Calif.). "Flexible interconnect circuits and methods of fabrication thereo... Read More


US Patent Issued to CANON on Nov. 3 for "Circuit board and image forming apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,162, issued on Nov. 3, was assigned to CANON K.K. (Tokyo). "Circuit board and image forming apparatus" was invented by Takeshi Honda (Chiba,... Read More